JPH02310040A - 電気積層板の製造方法 - Google Patents
電気積層板の製造方法Info
- Publication number
- JPH02310040A JPH02310040A JP13190989A JP13190989A JPH02310040A JP H02310040 A JPH02310040 A JP H02310040A JP 13190989 A JP13190989 A JP 13190989A JP 13190989 A JP13190989 A JP 13190989A JP H02310040 A JPH02310040 A JP H02310040A
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- resin
- metal plate
- hole
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title description 2
- 229910052751 metal Inorganic materials 0.000 claims abstract description 79
- 239000002184 metal Substances 0.000 claims abstract description 79
- 239000011347 resin Substances 0.000 claims abstract description 77
- 229920005989 resin Polymers 0.000 claims abstract description 77
- 239000002131 composite material Substances 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims description 27
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000011049 filling Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 abstract description 21
- 238000000034 method Methods 0.000 abstract description 5
- 238000005553 drilling Methods 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011888 foil Substances 0.000 description 8
- 229920001721 polyimide Polymers 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 239000000945 filler Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 5
- 238000003475 lamination Methods 0.000 description 5
- 239000009719 polyimide resin Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 239000002966 varnish Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical class O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229920000271 Kevlar® Polymers 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- -1 Lewis acid compound Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13190989A JPH02310040A (ja) | 1989-05-25 | 1989-05-25 | 電気積層板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13190989A JPH02310040A (ja) | 1989-05-25 | 1989-05-25 | 電気積層板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02310040A true JPH02310040A (ja) | 1990-12-25 |
| JPH0563304B2 JPH0563304B2 (en]) | 1993-09-10 |
Family
ID=15069013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13190989A Granted JPH02310040A (ja) | 1989-05-25 | 1989-05-25 | 電気積層板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02310040A (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303387A (ja) * | 2005-04-25 | 2006-11-02 | Mitsubishi Electric Corp | プリント配線板 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9313903B2 (en) * | 2008-12-25 | 2016-04-12 | Mitsubishi Electric Corporation | Method of manufacturing printed wiring board |
-
1989
- 1989-05-25 JP JP13190989A patent/JPH02310040A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006303387A (ja) * | 2005-04-25 | 2006-11-02 | Mitsubishi Electric Corp | プリント配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0563304B2 (en]) | 1993-09-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |